JPH03122550U - - Google Patents
Info
- Publication number
- JPH03122550U JPH03122550U JP3173490U JP3173490U JPH03122550U JP H03122550 U JPH03122550 U JP H03122550U JP 3173490 U JP3173490 U JP 3173490U JP 3173490 U JP3173490 U JP 3173490U JP H03122550 U JPH03122550 U JP H03122550U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum wiring
- case
- heat dissipation
- insulating substrate
- glued
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3173490U JPH03122550U (en]) | 1990-03-26 | 1990-03-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3173490U JPH03122550U (en]) | 1990-03-26 | 1990-03-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03122550U true JPH03122550U (en]) | 1991-12-13 |
Family
ID=31534526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3173490U Pending JPH03122550U (en]) | 1990-03-26 | 1990-03-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03122550U (en]) |
-
1990
- 1990-03-26 JP JP3173490U patent/JPH03122550U/ja active Pending